| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electrolytic treatment apparatus which includes a porous structure having low porosity, a high pressure drop, and a thickness and strength sufficient as a constitutive member of the apparatus, and for example, which can form a plating film having improved in-plane uniformity of the film thickness on the surface of a substrate by impregnating the inside of the porous structure with a plating solution, even when the substrate has a particularly large surface area and a thin conductive layer having a high electric resistance on its surface, when it is used as an electrolytic plating apparatus. Ž<P>SOLUTION: The electrolytic treatment apparatus performs an electrolytic treatment of a substrate W to be treated, which has a contact point with one electrode of an anode and a cathode, after filling an electrolytic solution between the substrate W to be treated and another electrode provided to face the substrate W to be treated. In the apparatus, a porous silica structure 110 using porous silica particles each having fine through-holes in its inside as primary particles is arranged in at least a portion of the electrolytic solution. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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