| 发明名称 |
RELIABLE INTERCONNECT INTEGRATION |
| 摘要 |
<p>A semiconductor device includes a dielectric layer in which an tipper portion is densified. An interconnection is disposed in the dielectric layer. The densified portion reduces undercut during subsequent processing, improving reliability of the interconnection. Fig. 1a</p> |
| 申请公布号 |
SG161188(A1) |
申请公布日期 |
2010.05.27 |
| 申请号 |
SG20090071796 |
申请日期 |
2009.10.29 |
| 申请人 |
CHARTERED SEMICONDUCTOR MANUFACTURING LTD |
发明人 |
HUANG LIU;WIDODO JOHNNY;YIHUA WANG;WUPING LIU;TI OUYANG;WEI LU |
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