Sn OR Sn ALLOY PLATING FILM AND METHOD FOR PRODUCING THE SAME

摘要

<P>PROBLEM TO BE SOLVED: To provide a Pb-free Sn or Sn alloy plating film in which a risk that whiskers are generated from the surface of the plating film around a conductor or solder is reduced or whiskers are hardly generated even in an environment where high external stress such as fitting with a connector is applied. Ž<P>SOLUTION: The Sn or Sn alloy plating film includes: an intermetallic compound layer 2 formed on the surface of a base material 1, composed of an intermetallic compound between the base material 1 and Sn and having electroconductivity; and a network structure 11 formed on the surface of the intermetallic compound layer 2 and composed of Sn or an Sn alloy. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž