PURPOSE: A method for manufacturing a light emitting display is provided to reduce manufacturing costs of the light emitting device by performing a manufacturing process of the light emitting device at once after connecting several growth substrates on a bonding substrate with a large area. CONSTITUTION: A semiconductor layer with an active area for emission is formed on a growth substrate(11). A plurality of growth substrates with respective semiconductor layers are arranged on one bonding substrate(30). The plurality of semiconductor layers respectively formed on the plurality of growth substrates are simultaneously processed through a post-process. The surface of the growth substrate faces the bonding substrate and the growth substrate is bonded on the bonding substrate.
申请公布号
KR20100055867(A)
申请公布日期
2010.05.27
申请号
KR20080114755
申请日期
2008.11.18
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KIM, KYOUNG KOOK;CHAE, SU HEE;PARK, YOUNG SOO;KIM, TAEK;YANG, MOON SEUNG;JEONG, HYUNG SU;PARK, JAE CHUL;KIM, JUN YOUN