METHODS, APPARATUS AND ARTICLES OF MANUFACTURE FOR TESTING A PLURALITY OF SINGULATED DIE
摘要
In one embodiment, a method for testing a plurality of singulated semiconductor die involves 1) placing each of the singulated semiconductor die on a surface of a die carrier, 2) mating an array of electrical contactors with the plurality of singulated semiconductor die, and then 3) performing electrical tests on the plurality of singulated semiconductor die, via the array of electrical contactors.
申请公布号
WO2010025231(A3)
申请公布日期
2010.05.27
申请号
WO2009US55165
申请日期
2009.08.27
申请人
VERIGY (SINGAPORE) PTE. LTD.;ANDERSON, JAMES, C.;HART, ALAN D.;KARKLIN, KENNETH D.
发明人
ANDERSON, JAMES, C.;HART, ALAN D.;KARKLIN, KENNETH D.