SUBSTRATE OF METAL PCB AND METHOD FOR MANUFACTURING THEREOF

摘要

PURPOSE: A substrate for a metal printed circuit board and a manufacturing method thereof are provided to obtain various thicknesses of substrate by forming an electric conductive layer through sputtering or screen printing. CONSTITUTION: A manufacturing method of a substrate for a metal printed circuit board comprises the steps of: preparing a metal base plate(210), spreading ceramic powder on the upper surface of the base plate to form a first ceramic layer(230), forming a first metal layer(250) on the upper surface of the first ceramic layer through sputtering for physical vapor deposition, spreading ceramic powder on the lower surface of the base plate to form a second ceramic layer, and forming a second metal layer on the lower surface of the base plate through the sputtering, thereby enabling circuit configuration on both sides of the substrate.