| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a uniform plating film at the inner wall of a thin tube having a fine inside diameter and a high aspect ratio. SOLUTION: An electrode line 12 in which a nonconductive member 14 preventing the contact of a fine tube 10 with an inner wall 10a is fixed to the outer circumferential face is inserted into the thin tube 10, in a state where a plating liquid is filled into a gap between the inner wall of the thin tube 10 and the electrode line 12, the electrode line 12 is reciprocated to the tube axis direction of the thin tube 10, and further, the plating liquid is alternately made to flow to the same direction as the electrode line 12. Then, with the electrode line 12 as a plus electrode and the thin tube 10 as a minus electrode, d.c. current is made to flow so as to form a plating film at the inner wall 10a of the thin tube 10. COPYRIGHT: (C)2010,JPO&INPIT
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