PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT EMPLOYING THE SAME, METHOD OF FORMING RESIST PATTERN, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD

摘要

The photosensitive resin composition of the present invention is a photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound with at least one polymerizable ethylenic unsaturated group in the molecule; and (C) a photopolymerization initiator, wherein component (A) contains a polymer that contains a compound represented by the following general formula (I) as a polymerization component: CH2═C(L1)-COOL2  (I) (wherein L1 represents a hydrogen atom or methyl group and L2 represents a C2-20 alkyl group group) and component (B) contains a compound represented by the following general formula (II): (wherein R1 represents a hydrogen atom or methyl group, R2 represents a C3-20 alkyl group that has at least 2 tertiary or higher carbon atoms, X represents a C2-6 alkylene group, and n is an integer from 1 to 20).