发明名称 |
Method for Producing a MEMS Package |
摘要 |
A carrier substrate has a mounting location with a number of electrical connection pads on a top side and external contacts connected thereto on an underside. A metal frame encloses the connection pads of the mounting location. A MEMS chip has electrical contacts on an underside. The MEMS chip is placed on the mounting location of the carrier substrate in such a way that the MEMS chip is seated with an edge region of its underside on the metal frame. Using a flip-chip process, the electrical contacts of the MEMS chip are connected to the connection pads of the carrier substrate by means of bumps the metal frame is connected to the MEMS chip such that a closed cavity is formed between MEMS chip and carrier substrate.
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申请公布号 |
US2010127377(A1) |
申请公布日期 |
2010.05.27 |
申请号 |
US20090627707 |
申请日期 |
2009.11.30 |
申请人 |
BAUER CHRISTIAN;FEIERTAG GREGOR;KRUEGER HANS;STELZL ALOIS |
发明人 |
BAUER CHRISTIAN;FEIERTAG GREGOR;KRUEGER HANS;STELZL ALOIS |
分类号 |
H01L23/485;H01L21/98 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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