| 摘要 |
<p>PURPOSE: A semiconductor light emitting device and a light emitting device package including the same are provided to remove the inconvenience of assembling a plurality of LED chips for a wanted color by implementing full colors with one chip. CONSTITUTION: A first conductive semiconductor layer(110) is provided. First to third light emitting structures are separated on the first conductive semiconductor layer. A first fluorescent material layer(142) is formed on the second light emitting structure. A second fluorescent material layer(144) is formed on the third light emitting structure.</p> |
