| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a module with a built-in component that can form a hollow cavity by storing a circuit component therein without contacting with a resin layer while thinning the thickness of the resin layer. <P>SOLUTION: A carrier 30 is configured so that a protrusion 31 for forming a cavity and first electrodes 23, 24 are formed on the upper face while each first circuit component 25, 26 is formed on each electrode. An uncured resin layer 20 is pressure-bonded to the carrier and cured. Next, the carrier 30 is peeled off from the resin layer 20 so as to embed the circuit components 25, 26 into the resin layer 20 while a recess 21 is formed at the lower face of the resin layer 20. The resin layer 20 is bonded to a substrate 1, mounted with a second circuit component 5 via an adhesive layer 10, thereby storing the second circuit component 5 in a hollow cavity 22. <P>COPYRIGHT: (C)2010,JPO&INPIT |
