| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent Cu in a base metal of a lead frame from diffusing to a solder side and to minimize the occurrence of voids at a bonding interface between the lead frame and the solder even when a thickness of Ni plating on a surface of the base metal is insufficient or zero, in an electronic apparatus where the lead frame, the base metal of which includes a Cu alloy, and an electronic component are bonded together via the solder. <P>SOLUTION: Solder 30 contains an Sn-Cu alloy, and a base metal 11 of a lead frame 10 contains 0.3 wt.% or more of Sn. An alloy layer 40 including an alloy of Cu and a component of the solder 30 is interposed between the base metal 11 and the solder 30. The base metal 11 and the solder 30 are in direct contact with the alloy layer 40, respectively. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
