| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of testing connecting conditions of an electronic device for detecting not only open failure but also non-wetting failure with higher accuracy. Ž<P>SOLUTION: The method of testing connecting conditions can test electrical connecting conditions between connecting portions of a solder bump and a land in the electronic device where a plurality of solder bumps arranged at a surface of an electronic component and a plurality of lands formed on electronic component loading surface of a wiring circuit board corresponding to the solder bumps are connected and electronic components are loaded at the upper part of the wiring circuit board. A connecting portion for testing included in the connecting portions is formed of the solder bump for testing formed adjacent to the solder bump at the one surface of the electronic component and the land for testing formed on the wiring circuit board corresponding to the solder bump for testing. This connecting portion, however, does not provide an electrical connecting function. Moreover, a resistance value of the connecting portion for testing can be measured under the condition that an external force is applied to at least one of the electronic component and wiring circuit board in the direction where the electronic component and wiring circuit board at the connecting portion for testing are separated. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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