发明名称 Heat Dissipating Module
摘要 A heat dissipating module is provided. The heat dissipating module includes a first heat dissipating unit and a second heat dissipating unit. The first heat dissipating unit has a first connecting portion. The second heat dissipating unit has a second connecting portion corresponding to the first connecting portion. The second connecting portion and the first connecting portion are connected to each other tightly.
申请公布号 US2010126709(A1) 申请公布日期 2010.05.27
申请号 US20090614527 申请日期 2009.11.09
申请人 ASUSTEK COMPUTER INC. 发明人 CHANG CHIN-LIEN;HSU MING-CHIEH;CHOU YA-CHYI
分类号 F28F7/00 主分类号 F28F7/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利