| 摘要 |
A pedestal style electronics enclosure provides an upright housing for enclosing electronic components. Installed at the top of the housing can be a hollow enclosure cap that defines an internal air gap. The air gap can be located between an upper, dome-like shield plate exposed to the exterior and a lower, contoured guide plate exposed to the interior of the enclosure. The air gap can help buffer the enclosure from solar radiation impinging upon the exterior shield plate. The interior contoured guide plate can help direct heated air rising in the interior of the enclosure to one or more vent panels located about the periphery of the cap. The hollow enclosure cap can be comprised of thermoplastic material and can be made as a single piece, monolithic structure produced by, for example, a blow molding process.
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