| 摘要 |
An antenna structure is integrated in a semiconductor chip. The antenna structure is formed by at least one of: a) one or more through-silicon vias (TSVs), and b) one or more crack stop structures. In certain embodiments, the antenna structure includes an antenna element formed by the TSVs. The antenna structure may further include a directional element formed by the crack stop structure. In certain other embodiments, the antenna structure includes an antenna element formed by the crack stop structure, and the antenna structure may further include a directional element formed by the TSVs.
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