| 发明名称 |
Interconnect System without Through-Holes |
| 摘要 |
Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.
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| 申请公布号 |
US2010127402(A1) |
申请公布日期 |
2010.05.27 |
| 申请号 |
US20100692974 |
申请日期 |
2010.01.25 |
| 申请人 |
INTERCONNECT PORTFOLIO LLC |
发明人 |
GRUNDY KEVIN P.;FJELSTAD JOSEPH C.;YASUMURA GARY;WIEDEMANN WILLIAM F.;SEGARAM PARA K. |
| 分类号 |
H01L23/48;H01L23/02;H01L23/13;H01L23/31;H01L25/10;H05K1/18;H05K3/40 |
主分类号 |
H01L23/48 |
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