发明名称 Confinement of Foam Delivered by a Proximity Head
摘要 In an example embodiment, a linear wet system includes a carrier and a proximity head in a chamber. The proximity head includes three sections in a linear arrangement. The first section suctions liquid from the upper surface of a semiconductor wafer as the wafer is transported by the carrier under the proximity head. The second section is configured to cause a film (or meniscus) of cleaning foam which is a non-Newtonian fluid to flow onto the upper surface of the wafer. The third section is configured to cause a film of rinsing fluid to flow onto the upper surface of the wafer as the wafer is carried under the proximity head. The third section is defined partially around the second section and up to the first section, so that the third section and the first section create a confinement of the cleaning foam with respect to the chamber.
申请公布号 US2010126528(A1) 申请公布日期 2010.05.27
申请号 US20080324316 申请日期 2008.11.26
申请人 KHOLODENKO ARNOLD;LIN CHENG-YU SEAN;GINZBURG LEON;MANDELBOYM MARK;TOMASCH GREGOGRY A;HUSAIN ANWAR 发明人 KHOLODENKO ARNOLD;LIN CHENG-YU (SEAN);GINZBURG LEON;MANDELBOYM MARK;TOMASCH GREGOGRY A.;HUSAIN ANWAR
分类号 B08B3/04;B08B5/04 主分类号 B08B3/04
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