发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide an IC tag which enables an interposer to be easily and firmly connected to an antenna circuit and protects an IC chip without additional processing. <P>SOLUTION: An IC tag 1 is provided with an antenna-formed sheet 3 and an interposer 2 arranged on the antenna-formed sheet 3. The antenna-formed sheet 3 comprises a base sheet 20 and an antenna circuit 22. The interposer 2 comprises a supporting sheet 10, a pair of extended electrodes 13 which is arranged on the supporting sheet 10 and coated with a nonconductive bonding agent 17 on its surface not facing the supporting sheet 10, and an IC chip 15. The surface of the interposer 2 on the IC chip 15 side faces the surface of the antenna-formed sheet 3 on the antenna circuit 22 side. The extended electrodes 13 of the interposer 2 are connected to the antenna by caulking, ultrasonic wave bonding, or thermocompression bonding. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP4467352(B2) 申请公布日期 2010.05.26
申请号 JP20040128351 申请日期 2004.04.23
申请人 发明人
分类号 B42D15/10;G06K19/077;G06K19/07 主分类号 B42D15/10
代理机构 代理人
主权项
地址
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