| 摘要 |
PROBLEM TO BE SOLVED: To provide a power semiconductor module of an insulating transfer mold package which is reliable and suitable for water cooling. SOLUTION: The power semiconductor module comprises a power semiconductor chip, a circuit pattern to which the power semiconductor chip is bonded, a main terminal for supplying a current to the outside, and a control terminal for controlling the power semiconductor chip. In is sealed with a transfer mold package of a thermosetting resin. The upper surface of the package is provided with an opening part through which the circuit pattern is exposed, with the terminal bonded to the circuit pattern, and the terminal is disposed on the upper surface of the package. On the bottom surface of the package, a metal plate is exposed to surround the circuit pattern so that the metal plate makes direct contact with the cooling water. |
