| 摘要 |
<p>A liquid cooling jacket and a system for use in an electronic apparatus, preferable in the cooling capacity or performance, with less in man-hour and manufacturing costs in need of process thereof, and applicable into a narrow space, wherein a plural number of lamination plates (1), each being formed through the punching process, are piled up in the width direction thereof, for each piece thereof, and are bonded with each other. A cooling liquid flows in a flow passage (8) defined between the laminating plates, and the laminating plates themselves function as a cooling fin. <IMAGE></p> |
