Semiconductor module with control functionality and integrated transformer

摘要

The module has electrically insulated conducting paths arranged on a substrate (2) e.g. direct copper bonding substrate. Semiconductor components (4) are arranged on the conducting paths. A connection device (6) has electrical conductive layers and electrical insulation layers for connection of the semiconductor components, the conducting paths and/or a contact device (10). The electrical conductive layers form connection paths. A transmitter (70) is integrally formed from components e.g. resistors, of the connection device. The transmitter is provided with transmitter and receiver coils.