发明名称 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR FORMATION OF CURED FILM USING THE SAME
摘要 Disclosed is a positive-type photosensitive resin composition comprising: a resin which has a specific acrylic acid-type constituent unit whose dissociating group can be dissociated to produce a carboxyl group, which is insoluble or poorly soluble in an alkali, and whose acid-dissociating group can be dissociated to render the resin alkali-soluble; a resin which has a constituent unit having a functional group capable of reacting with a carboxyl group to form a covalent bond; and a compound which can generate an acid upon being irradiated with an active ray or an radioactive ray. The positive-type photosensitive resin composition is excellent in sensitivity, percentage residual film and storage stability. Also disclosed is a cured film produced by a cured film formation method using the positive-type photosensitive resin composition. The cured film is excellent in heat resistance, an adhesion property, transmittance and the like.
申请公布号 KR20100055508(A) 申请公布日期 2010.05.26
申请号 KR20107006294 申请日期 2008.09.26
申请人 FUJIFILM CORPORATION 发明人 TAKITA SATOSHI
分类号 G03F7/039;G03F7/40;H01L21/027 主分类号 G03F7/039
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