发明名称 |
WAFER SHAPE EVALUATING METHOD AND DEVICE AND DEVICE PRODUCING METHOD, WAFER AND WAFER SELECTING METHOD |
摘要 |
<p>There are provided a method and an apparatus for evaluating a wafer configuration which can accurately evaluate a peripheral portion of a wafer as compared with the conventional SFQR or the like, which comprises: measuring a configuration of a wafer at positions with a prescribed space within a surface of the wafer; providing a first region (W1) within the wafer surface for calculating a reference line or a reference plane from the measured wafer configuration; calculating a reference line (10a) or a reference plane (10b) in the first region (W1); providing a second region (W2) to be evaluated outside the first region; extrapolating the reference line (10a) or reference plane (10b) to the second region (W2); analyzing a difference between the configuration of the second region and the reference line or reference plane within the second region; and calculating the analyzed difference as surface characteristics.</p> |
申请公布号 |
EP1335420(A4) |
申请公布日期 |
2010.05.26 |
申请号 |
EP20010996881 |
申请日期 |
2001.11.15 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD. |
发明人 |
KOBAYASHI, MAKOTO;MATSUKAWA, KAZUHITO;YAMAMOTO, HIDEKAZU;MAEJIMA, SHINROKU |
分类号 |
H01L21/304;G01B21/30;H01L21/66 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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