| 摘要 |
PURPOSE: The metal layer is formed into the metal with a superior communications module is the electromagnetic wave absorption performance. The radio frequency shielding performance is improved. CONSTITUTION: The parts-mounted groove(120) for the electromagnetic interference shielding is formed in the task domain of the PCB(100). The RF part(103) is located on surface PCB. The metal layer(110) is plated in the wall of the parts-mounted groove. The metal layer is connected to the ground of PCB. The radio frequency shielding performance is improved by forming into the metal with a superior electromagnetic wave absorption performance including the metal layer is the copper, the silver etc.
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