HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD OF THE SAME

摘要

PURPOSE: The radiation substrate and manufacturing method thereof use the heat dissipation insulating layer and metal sheet without the use of the metal core. The protection against heat performance is improved. CONSTITUTION: The first circuit layer(114a) is formed in the single-side of the heat dissipation insulating layer(106). The first circuit layer comprises the first metal sheet and the first plating layer(112a). The second circuit layer(114b) is formed in the other side of the heat dissipation insulating layer. The second circuit layer comprises the second metal sheet(102b) and the second plating layer(112b).