Assembly with semiconductor module and driver device

摘要

The arrangement comprises a power semiconductor module with a substrate (4) having an auxiliary connection element and the load connection elements (6,8,10). A sensor is arranged on the load connection element in a moving manner. A driver device (14) has a printed circuit board (16) and housing (18) with a cover (20) and a support (22). The stop elements are located in the housing, where the driver device is arranged above the power semiconductor module.