POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION

摘要

PURPOSE: A positive photosensitive resin composition, a photoresist resin film using thereof, and a semiconductor device including thereof are provided to improve mechanical property and heat resistance of the film while maintaining high sensitivity and high definition. CONSTITUTION: A positive photosensitive resin composition contains 100 parts of polyimide-polybenzoxazole alternating copolymer precursor by weight, 5~100 parts of photo sensitive diazoquinone compound by weight, 0,1~30 parts of silane compound by weight, 1~30 parts of phenolic compound by weight, and 200~900 parts of solvent by weight.