| 摘要 |
The present invention is related to a method for providing solder material on a predetermined area on a substrate, comprising the steps of providing a substrate (1), producing a confinement layer (7) extending on a first area of a first surface of the substrate, said confinement layer comprising a confinement material, the confinement material and the solder material repelling each other, producing a wetting layer (9), extending on a second area, comprising a wetting material, the second area lying within the first area, the wetting material attracting the solder material, depositing the solder material (10) on a part of the wetting layer, said solder material being indium, reflowing the solder material until the wetting layer is covered with a layer of solder material. <??>Further a novel packaging method is disclosed. Also a novel type of package is described. <IMAGE> |
