发明名称 |
High thermal conductive aluminum nitride sintered body |
摘要 |
The high thermal conductive aluminum nitride sintered body according to the present invention has: a thermal conductivity of 220 W/m · K or more; and a three point bending strength of 250 MPa or more; wherein a ratio (I Al 2 Y 4 O 9 /I AIN ) of X-ray diffraction intensity (I Al 2 Y 4 O 9 ) of Al 2 Y 4 O 9 (201 plane) with respect to X-ray diffraction intensity (I AIN ) of aluminum nitride (101 plane) is 0.002 to 0.03. According to the foregoing structure, there can be provided an aluminum nitride sintered body having a high thermal conductivity and excellent heat radiating property. |
申请公布号 |
EP2189432(A2) |
申请公布日期 |
2010.05.26 |
申请号 |
EP20100002627 |
申请日期 |
2004.11.18 |
申请人 |
KABUSHIKI KAISHA TOSHIBA;TOSHIBA MATERIALS CO., LTD. |
发明人 |
KOMATSU, MICHIYASU;KIMIYA, MIYASHITA |
分类号 |
C04B35/581;C04B35/626;C04B35/63;C04B35/638 |
主分类号 |
C04B35/581 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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