发明名称 |
Adhesive preparation package |
摘要 |
The present invention provides an adhesive preparation package containing an adhesive preparation (2) and a packaging film(s) enclosing said preparation, the packaging films being heat-sealed around the adhesive preparation, wherein the heat-sealed portion of the packaging film comprises an embossed heat-sealed portion (4) and a flat heat-sealed portion (3), and the embossed heat-sealed portion and the flat heat-sealed portion each form a pattern surrounding the periphery of the adhesive preparation. The adhesive preparation package of the present invention is free of occurrence of pinholes in a heat-sealed portion and can maintain superior air-tightness and sterility. |
申请公布号 |
EP1612158(B1) |
申请公布日期 |
2010.05.26 |
申请号 |
EP20050013932 |
申请日期 |
2005.06.28 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
NINOMIYA, KAZUHISA;GOSHIMA, SHOJI |
分类号 |
B65D75/04;B65D75/20;B65D75/30 |
主分类号 |
B65D75/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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