发明名称 Adhesive preparation package
摘要 The present invention provides an adhesive preparation package containing an adhesive preparation (2) and a packaging film(s) enclosing said preparation, the packaging films being heat-sealed around the adhesive preparation, wherein the heat-sealed portion of the packaging film comprises an embossed heat-sealed portion (4) and a flat heat-sealed portion (3), and the embossed heat-sealed portion and the flat heat-sealed portion each form a pattern surrounding the periphery of the adhesive preparation. The adhesive preparation package of the present invention is free of occurrence of pinholes in a heat-sealed portion and can maintain superior air-tightness and sterility.
申请公布号 EP1612158(B1) 申请公布日期 2010.05.26
申请号 EP20050013932 申请日期 2005.06.28
申请人 NITTO DENKO CORPORATION 发明人 NINOMIYA, KAZUHISA;GOSHIMA, SHOJI
分类号 B65D75/04;B65D75/20;B65D75/30 主分类号 B65D75/04
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