发明名称 |
Methods of low temperature oxidation |
摘要 |
A method for forming a dielectric is provided. The method includes providing a substrate having a silicon-containing semiconductor layer within a process chamber. The process chamber is capable of ionizing a process precursor to a plasma comprising an oxygen-containing element and a fluorocarbon-containing element. A surface portion of the silicon-containing material is oxidized by using the plasma to convert the surface portion into an oxidized dielectric material.
|
申请公布号 |
US7723240(B2) |
申请公布日期 |
2010.05.25 |
申请号 |
US20080121382 |
申请日期 |
2008.05.15 |
申请人 |
MACRONIX INTERNATIONAL CO., LTD. |
发明人 |
HONG SHIH-PING;HSU HAN-HUI |
分类号 |
H01L21/31 |
主分类号 |
H01L21/31 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|