MOUNTING STATE EXAMINATION METHOD OF CHIP MOUNTER

摘要

PURPOSE: A method for inspecting part mounting accuracy and a substrate arrangement state of a substrate is provided to improve productivity of the part mounting process by inspecting the part mounting accuracy and the substrate arrangement state without an additional inspection device. CONSTITUTION: A substrate inspection mode is performed with the manipulation of a controller(S100). The substrate arrangement state or part mounting accuracy is inspected based on the image obtained by a recognition camera(S200). If the substrate arrangement state or part mounting accuracy is trouble, the type of the problem is determined(S300). The substrate arrangement state or part mounting accuracy is corrected by inputting a correction value to the controller(S400).