发明名称 |
Pad and circuit board, electronic device using same |
摘要 |
A pad for soldering a contact of a surface mounted component is provided herein. The pad includes a central portion and a plurality of separate extending portions extending from the central portion. All of the plurality of separate extending portions includes a free end and a connected end connected to the central portion. A width of the free end is larger than a width of the connected end. A circuit board and an electronic device are also provided.
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申请公布号 |
US7723855(B2) |
申请公布日期 |
2010.05.25 |
申请号 |
US20070967098 |
申请日期 |
2007.12.29 |
申请人 |
HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
TSAI SHU-JEN;CHEN LONG-FONG;TSENG WEN-HAW;WONG SHIH-FANG |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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