| 发明名称 |
LIGHT EMITTING DIODE PACKAGE |
| 摘要 |
<p>PURPOSE: A light emitting diode package is provided to improve the luminous efficiency of a light-emitting diode by reducing the amount of the light trapped in the side wall of the package body. CONSTITUTION: In a light emitting diode package, a pair of lead frames are provided. A package body(120) accepts one side of the lead frame. The package body includes a side wall of a ring shape forming a cavity(125) at the center. An LED chip(130) is mounted on the lead frame in the cavity.</p> |
| 申请公布号 |
KR20100054457(A) |
申请公布日期 |
2010.05.25 |
| 申请号 |
KR20080113398 |
申请日期 |
2008.11.14 |
| 申请人 |
SAMSUNG LED CO., LTD. |
发明人 |
JUNG, SOO JIN;KIM, HYUNG KUN;KIM, HAK HWAN |
| 分类号 |
H01L33/48;H01L33/62 |
主分类号 |
H01L33/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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