| 摘要 |
Provided are a film-type semiconductor package and method using test pads shared by output channels, a test device, and a semiconductor device and method using patterns shared by test channels. The semiconductor device includes a film-type semiconductor package and a test device. The film-type semiconductor package outputs test signals through a plurality of test pads. The test device tests the film-type semiconductor package using the test signals. A printed circuit board (PCB) of the test device includes a plurality of common patterns, each of which connects at least two of a plurality of test channels to an input terminal, the test channels connecting the input terminals to the test pins. When the film-type semiconductor package, the method of testing the semiconductor package, the semiconductor device and the test device, and the method of testing the film-type semiconductor package in the semiconductor device are used, the film-type semiconductor package can be tested without replacing an existing test device.
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