| 摘要 |
A feedthrough assembly for an implantable medical device includes an insulator element hermitically sealed to a ferrule and a feedthrough member, and a capacitive element spaced apart from the insulator element within the ferrule and coupled to the feedthrough member by a conductive material; the conductive material extends in an area between the capacitive element and the feedthrough member. The assembly further includes a heat and pressure deformed thermoplastic adhesive member that extends around the feedthrough member within the ferrule, is located between the capacitive element and the insulator element, and is sealed to an external surface of the capacitive element in order to isolate the conductive material.
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