发明名称 |
Thin multi-chip flex module |
摘要 |
A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.
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申请公布号 |
US7724530(B2) |
申请公布日期 |
2010.05.25 |
申请号 |
US20080317890 |
申请日期 |
2008.12.30 |
申请人 |
MICROELECTRONICS ASSEMBLY TECHNOLOGIES, INC. |
发明人 |
CLAYTON JAMES E.;FATHI ZAKARYAE |
分类号 |
H05K1/00;H05K7/20 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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