发明名称 Gas distribution system for improved transient phase deposition
摘要 Embodiments of the present invention are directed to a gas distribution system which distributes the gas more uniformly into a process chamber. In one embodiment, a gas distribution system comprises a gas ring including an outer surface and an inner surface, and a gas inlet disposed at the outer surface of the gas ring. The gas inlet is fluidicly coupled with a first channel which is disposed between the outer surface and the inner surface of the gas ring. A plurality of gas outlets are distributed over the inner surface of the gas ring, and are fluidicly coupled with a second channel which is disposed between the outer surface and the inner surface of the gas ring. A plurality of orifices are fluidicly coupled between the first channel and the second channel. The plurality of orifices are spaced from the gas inlet by a plurality of distances, and have sizes which vary with the distances from the gas inlet as measured along the first channel, such that the size of the orifice increases with an increase in the distance between the orifice and the gas inlet as measured along the first channel.
申请公布号 US7722737(B2) 申请公布日期 2010.05.25
申请号 US20050123453 申请日期 2005.05.04
申请人 APPLIED MATERIALS, INC. 发明人 GONDHALEKAR SUDHIR;DUNCAN ROBERT;SALIMIAN SIAMAK;RASHEED MUHAMMAD M.;WHITESELL HARRY SMITH;GEOFFRION BRUNO;KRISHNARAJ PADMANABHAN;GUJER RUDOLF
分类号 H01L21/326;C23C16/505 主分类号 H01L21/326
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