发明名称 Method of manufacturing alloy circuit board
摘要 A method of manufacturing an alloy circuit board including an alloy circuit made of an alloy of first metal particles and second metal particles includes forming a first circuit layer, by printing ink containing first metal particles on a board; stacking a second circuit layer on the first circuit layer, by printing ink containing second metal particles on the board; and sintering the first circuit layer and the second circuit layer by heating so as to form the alloy of the first metal particles and the second metal particles.
申请公布号 US7721423(B2) 申请公布日期 2010.05.25
申请号 US20070902049 申请日期 2007.09.18
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM YOUNG-JAE;JOUNG JAE-WOO;YOO YOUNG-SEUCK
分类号 H05K3/20;H05K1/09 主分类号 H05K3/20
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