发明名称 |
Method of manufacturing alloy circuit board |
摘要 |
A method of manufacturing an alloy circuit board including an alloy circuit made of an alloy of first metal particles and second metal particles includes forming a first circuit layer, by printing ink containing first metal particles on a board; stacking a second circuit layer on the first circuit layer, by printing ink containing second metal particles on the board; and sintering the first circuit layer and the second circuit layer by heating so as to form the alloy of the first metal particles and the second metal particles.
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申请公布号 |
US7721423(B2) |
申请公布日期 |
2010.05.25 |
申请号 |
US20070902049 |
申请日期 |
2007.09.18 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM YOUNG-JAE;JOUNG JAE-WOO;YOO YOUNG-SEUCK |
分类号 |
H05K3/20;H05K1/09 |
主分类号 |
H05K3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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