发明名称 |
PRINTED CIRCUIT BOARD ASSEMBLY OF ELECTRONIC APPLIANCE |
摘要 |
PURPOSE: A substrate assembly of an electronic device is provided to prevent the damage to a substrate due to the friction between wires by insulating a plurality of substrates through an insulator. CONSTITUTION: A substrate assembly of an electronic device comprises a plurality of power substrates(50,60). Each power substrate comprises electric parts. The electric parts with different electric specification are installed at the substrates, respectively. At the substrates, MICOMs(51,61) are respectively formed. The MICOMs interlink the substrates in a serial communication. An insulator is formed between the substrates. The insulator connects the substrates in an insulating state. |
申请公布号 |
KR20100054263(A) |
申请公布日期 |
2010.05.25 |
申请号 |
KR20080113103 |
申请日期 |
2008.11.14 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JANG, SANG WOOK;SATORU MATSUMOTO |
分类号 |
D06F33/02;H05K3/00 |
主分类号 |
D06F33/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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