PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve the adhesive force between a second metal film and a polymer film in the high temperature environment by arranging a third metal film between a third metal film and the polymer film. CONSTITUTION: A first metal film(10) includes the copper or the copper alloy. A polymer film(40) is located in one-side of the first metal film. A second metal film(20) is arranged between the first metal film and the polymer film. The second metal film includes a first surface(21) towards the first metal film and a second surface(22) towards a polymer film. The second metal film is made of the nickel or the nickel alloy. A third metal film is arranged between the second surface of the second metal film and the polymer film. The third metal film is made of the nickel, the palladium, the gold or their alloy.