发明名称 APPARATUS FOR MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME
摘要 PURPOSE: A manufacturing device of a printed circuit board and a manufacturing device thereof are provided to execute a via hole formation process, a desmear process, and a coating layer formation process by using a shutter part. CONSTITUTION: A gas inlet part(120) injects process gas into a vacuum chamber(110). A succeptor(130) is arranged in the inside of the vacuum chamber. A substrate is installed on the susceptor. A sputtering target part(150) faces the susceptor. The sputtering target part is installed to a voltage source part. The sputtering target part applies a voltage to the sputtering target part. A shutter part(170) is arranged between the sputtering target part and the susceptor. A shutter driving part opens and closes the shutter part.
申请公布号 KR20100053771(A) 申请公布日期 2010.05.24
申请号 KR20080112554 申请日期 2008.11.13
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 HEO, CHEOL HO;YANG, DEK GIN;HWANG, SEONG CHUL;HEO, KYUNG JIN;HWANG, YUN SEOK
分类号 H05K3/00;H01L21/00;H05K3/18 主分类号 H05K3/00
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