发明名称 |
APPARATUS FOR MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME |
摘要 |
PURPOSE: A manufacturing device of a printed circuit board and a manufacturing device thereof are provided to execute a via hole formation process, a desmear process, and a coating layer formation process by using a shutter part. CONSTITUTION: A gas inlet part(120) injects process gas into a vacuum chamber(110). A succeptor(130) is arranged in the inside of the vacuum chamber. A substrate is installed on the susceptor. A sputtering target part(150) faces the susceptor. The sputtering target part is installed to a voltage source part. The sputtering target part applies a voltage to the sputtering target part. A shutter part(170) is arranged between the sputtering target part and the susceptor. A shutter driving part opens and closes the shutter part.
|
申请公布号 |
KR20100053771(A) |
申请公布日期 |
2010.05.24 |
申请号 |
KR20080112554 |
申请日期 |
2008.11.13 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
HEO, CHEOL HO;YANG, DEK GIN;HWANG, SEONG CHUL;HEO, KYUNG JIN;HWANG, YUN SEOK |
分类号 |
H05K3/00;H01L21/00;H05K3/18 |
主分类号 |
H05K3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|