SEMICONDUCTOR INTEGRATED CIRCUIT CHIP, MULTILAYER CHIP CAPACITOR AND SEMICONDUCTOR INTEGRATED CIRCUIT CHIP PACKAGE

摘要

PURPOSE: A semiconductor integrated circuit chip, a multilayer chip capacitor and a semiconductor integrated circuit chip package are provided to keep the impedance of electric power distribution networks in high frequency by minimizing the inductance of the semiconductor between an integrated circuit chip and a decoupling capacitor. CONSTITUTION: An input-output terminal is formed in an external side of a semiconductor IC chip main body(101). A decoupling capacitor(103) is arranged in the side of the semiconductor IC chip main body. The decoupling capacitor is electrically connected to the input-output terminal. The decoupling capacitor comprises a capacitor main body, a first and a second inner electrode, and a first and a second external electrode.