Metal-oxide-semiconductor field-effect transistor's electronic power chip soldering method for electric conductor forming support, involves maintaining temperature of thermode to be lower than temperature of another thermode

摘要

The method involves contacting a thermode (1) with an electronic chip (4), where temperature (T1) of the thermode is lower than the temperature (T2) of another thermode (2). The electronic chip is maintained in a cavity (10) of the former thermode by a vacuum effect created in the cavity. A support element (3) is mounted at an end of the soldering of the electronic chip. The electronic chip is cooled by using the fluid i.e. low pressure air, at low temperature. An independent claim is also included for a device for soldering an electronic chip.