| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device hardly causing a failure and capable of carrying out stable operation over a long time. <P>SOLUTION: The semiconductor device 1 includes: a semiconductor chip 2; a frame 3 or a substrate for mounting the semiconductor chip 2 thereon; a resin without containing a halogenated flame retardant for sealing the semiconductor chip 2; and a gettering part 4 capturing impurity ions around the semiconductor chip 2. The semiconductor device can be applied to a module product where a printed board mounted with a lot of the semiconductor devices 1 or the semiconductor chips 2 is sealed by a halogen-free resin. <P>COPYRIGHT: (C)2010,JPO&INPIT |
