| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for joining a sealing substrate to a semiconductor substrate of a chip-size package with good yield. SOLUTION: A method for joining the substrates includes steps of: holding a wafer 25 and a glass substrate 33 in a position where a spacing S between the wafer 25 and the glass substrate 33 becomes, for example, about 1 mm; illuminating an end edge of the wafer 25 and an end edge of the glass substrate 33, both the end edges facing each other, with first to third lights 105 to 107 arranged circumferentially at even intervals; imaging the spacing between the wafer 25 and the glass substrate 33 with first to third cameras 102 to 104 for imaging the spacing between the substrates, the cameras being arranged while facing the first to third lights 105 to 107; calculating the three point spacings L1 to L3 between the wafer 25 and the glass substrate 33 on the basis of the image data; determining parallelism of the wafer 25 to the glass substrate 33 on the basis of the calculation result of the spacings L1 to L3; and carrying out parallelism adjustment through tilting of a wafer base plate 60 to attain the parallelism between joining surfaces of the wafer 25 and the glass substrate 33, if the parallelism is not enough. COPYRIGHT: (C)2010,JPO&INPIT |
