PLATING METHOD FOR AIRTIGHT TERMINAL

摘要

PROBLEM TO BE SOLVED: To provide a package for a crystal oscillator such that surface plating layers of a metal outer ring and through leads of an airtight terminal are formed within desired rate ranges and the plating thickness on the through leads is made larger than the plating thickness on the metal outer ring side within a predetermined rate. SOLUTION: The package 10 for the crystal oscillator includes a cylindrical airtight terminal 20, a cylindrical metal cap 30, and a crystal piece 40 soldered to package inner sides 23a as upper ends of the through leads 23. The plating layers formed on surfaces of the metal outer ring and the pair of through leads 23 of the airtight terminal 20 are formed such that the plating thickness of the metal outer ring is selected within a range of 4 to 15 μm and the thickness of the plating layers of the through leads is 1.6 to 2.5 times as large as the thickness of the plating layer of the metal outer ring. COPYRIGHT: (C)2010,JPO&INPIT