| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a molding apparatus and a molding method of a resin molded component which cause a burr not to be generated in a molded resin molded component and enables an exact mold release resistance force to be measured, and which can maintain the quality of the resin molded component. Ž<P>SOLUTION: The molding apparatus of a resin molded component includes: a mold 2 which has a cavity 1; an ejector pin path 9 which communicates from an opening prepared in the bottom face of the cavity 1 to an opening prepared in the bottom face of the mold 2; an ejector pin 6 which can move in the ejector pin path 9; and a knocking up means 8 arranged directly under the opening of the bottom face of the mold 2. Moreover, the ejector pin 6 includes a lid part 3 and a shank 4: the shank 4 is located in the ejector pin path 9, and the lid part 3 is located in a cavity so that the opening prepared in the bottom face of the cavity 11 can be plugged up. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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