| 摘要 |
PROBLEM TO BE SOLVED: To more quickly cut a laminated type semiconductor wafer without leaving an uncut part while a wire is stretched. SOLUTION: The bending of the wire 14 is not caused by imparting force to the wire 14 with a blade 19 or a magnet 21, and a sensor wafer module 1 that is the laminated type semiconductor wafer is more quickly horizontally cut without leaving the uncut part when the wire 14 is horizontally stretched. The sensor wafer module 1 is provided with a resin adhesive layer 3, a glass plate 4 and a lens wafer module 5 on a sensor wafer 2. The lens wafer module 5 and the glass plate 4 and further the resin adhesive layer 3 are flatly cut by the wire 14, and the sensor wafer 2 is beautifully cut by a dicer from an opposite side. COPYRIGHT: (C)2010,JPO&INPIT |
